FX70 Fanless CPU Cooler Discontinued | |
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Zalman FX70 Fanless CPU Cooler
With its unique fin design the Zalman FX70 has been designed to passively cool any CPU that has a TDP of 95W or lower. For more powerful CPUs simply add one or two 120mm fans using the supplied fan clips.
Zalman have produced some of the best CPU coolers over the years and the new FX70 is no exception. It is designed primarily as a passive heatsink that is able to cool CPUs that have a Thermal Design Power (TDP) of 80W or lower. It achieves this remarkable feat by adopting a twist heatsink fin design that utilises natural convection to easily allow the warm air to move away from the heatsink’s fins. The benefits of using a passive cooler not only means zero noise, but there is also no dust build-up so therefore no maintenance is required.
Features
- High performance fanless design
- Twist heatsink structure
- Six high performance heatpipes
- Black-pearl nickel plated heatsink
- Wide compatibility
- ZM-STG2M thermal compound provided
- Optional 120mm fans can be installed
To transfer the heat from the CPU to the fins, the cooler uses six 6mm high performance U-shaped heatpipes. The whole cooler has been coated in a black pearl nickel finish that makes it look and feels fantastic. It is compatible with virtually all current desktop sockets including Intel’s LGA2011/1155/1156/1150/1366/775 and AMD’s FM1/FM2/AM3+/AM3/AM2+/AM2 sockets.
The FX70 is not limited to CPUs that are 80W or lower, if a higher wattage CPU is required then it is possible to add one or even two 120mm fans (sold separately) to the heatsink, thanks to Zalman supplying two fan clips.
Specifications | FX70 |
---|---|
Intel Socket Compatibility | LGA2011/1155/1156/1150/1366/775 |
AMD Socket Compatibility | FM1/FM2/AM3+/AM3/AM2+/AM2 |
Max CPU TDP | Fanless mode 80W * |
Installation method | Backplate, require motherboard removal |
Heatsink dimensions | 110(L) x 140(W) x 158(H)mm |
Weight | 530g |
Material | Pure Copper and Aluminium |
Noise Level | 0 dBA |
Warranty | 24 months |
EAN barcode | 8809213766237 |
- *Any CPU with a TDP above 80W requires a 120mm fan attached to the heatsink
Specifications | FX70 |
---|---|
Intel Socket Compatibility | LGA2011/1155/1156/1150/1366/775 |
AMD Socket Compatibility | FM1/FM2/AM3+/AM3/AM2+/AM2 |
Max CPU TDP | Fanless mode 80W * |
Installation method | Backplate, require motherboard removal |
Heatsink dimensions | 110(L) x 140(W) x 158(H)mm |
Weight | 530g |
Material | Pure Copper and Aluminium |
Noise Level | 0 dBA |
Warranty | 24 months |
EAN barcode | 8809213766237 |
- *Any CPU with a TDP above 80W requires a 120mm fan attached to the heatsink
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